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dc.contributor.authorWdowik, R.
dc.contributor.authorRATNAYAKE MUDIYANSELAGE, Chandima
dc.contributor.authorZolkos, M.
dc.contributor.authorMagdziak, Marek
dc.contributor.authorValino, G.
dc.contributor.authorAlvarez, B.J.
dc.contributor.authorMisiura, J.
dc.date.accessioned2023-02-14T12:02:48Z
dc.date.available2023-02-14T12:02:48Z
dc.date.created2020-12-16T20:37:39Z
dc.date.issued2020
dc.identifier.citationWdowik, R., Ratnayake, R. C., Żółkoś, M., Magdziak, M., Valiño, G., Álvarez, B. J., & Misiura, J. (2020). Digitization methods of grinding pins for technological process planning. Procedia Manufacturing, 51, 1054-1061.en_US
dc.identifier.issn2351-9789
dc.identifier.urihttps://hdl.handle.net/11250/3050681
dc.description.abstractThe paper presents different techniques for digitizing grinding pins and discusses the use of digitalized pins and the results of measurements in technological process planning (TPP), focusing on the challenges of the digital era. It describes the potential of different measuring devices, taking into account the digitization of a real tool shape into virtual 2D and 3D models. The following methods for measuring grinding pins are presented in the study: contact and non-contact coordinate measurements – performed on coordinate measuring machines (CMM); optical measurements on microscopes (i.e. focus-variation technique); optical measurements using tool presetters; optical measurements with measuring arm; laser micrometer measurements; and laser triangulation sensor measurements. Moreover, the use of testers which are applied in contour measurements is analyzed. On the basis of the presented methods, taking into account their possibilities and limitations, we discuss how the obtained digital data can be used in the planning of technological processes.en_US
dc.language.isoengen_US
dc.publisherElsevieren_US
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.titleDigitization Methods of Grinding Pins for Technological Process Planningen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.rights.holderThe authorsen_US
dc.subject.nsiVDP::Teknologi: 500en_US
dc.source.pagenumber1054-1061en_US
dc.source.volume51en_US
dc.source.journalProcedia Manufacturingen_US
dc.identifier.doi10.1016/j.promfg.2020.10.148
dc.identifier.cristin1860757
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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