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dc.contributor.authorJiregna, Iyasu T
dc.contributor.authorLemu, Hirpa G.
dc.date.accessioned2021-12-22T12:46:48Z
dc.date.available2021-12-22T12:46:48Z
dc.date.created2021-12-12T14:21:51Z
dc.date.issued2021
dc.identifier.citationJiregna,I.T., Lemu, H.G. (2021) Thermal stress analysis of disc brake using analytical and numerical methods. IOP Conference Series: Materials Science and Engineering, 1201, 012033en_US
dc.identifier.issn1757-8981
dc.identifier.urihttps://hdl.handle.net/11250/2835392
dc.description.abstractThis article presents study of the thermal stress development in brake disc and the associated life cycle of the disc. The thermal stress analysis of disc brake under the first brake application and the influences of thermal loads on stress development of the disc have been investigated. The temperature distribution was conducted as a function of disc thickness and braking time. The study was done on the disc brake of Sports Utility Vehicle with a model of DD6470C. Partial solution approach was used to solve analytical temperature distribution through the thickness. The model was done using representative areas of the disc exposed to high temperature whose distribution result was obtained as a function of disc thickness and braking time. The solutions of coupled thermal transient fields and stress fields were obtained based on thermal-structural coupled analysis. Based on the model developed for the study, the positions of high and low stress formations were investigated, and it has been observed that thermal stress and temperature gradient show similar behavior through the thickness of disc. Generally, high temperature and stress components were found on the rubbing surfaces of the disc.en_US
dc.language.isoengen_US
dc.publisherIOP Publishingen_US
dc.rightsNavngivelse 4.0 Internasjonal*
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/deed.no*
dc.subjectteknologien_US
dc.titleThermal stress analysis of disc brake using analytical and numerical methodsen_US
dc.typePeer revieweden_US
dc.typeJournal articleen_US
dc.description.versionpublishedVersionen_US
dc.subject.nsiVDP::Teknologi: 500en_US
dc.source.pagenumber11en_US
dc.source.volume1201en_US
dc.source.journalIOP Conference Series: Materials Science and Engineeringen_US
dc.identifier.doi10.1088/1757-899X/1201/1/012033
dc.identifier.cristin1967420
dc.source.articlenumber012033en_US
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1


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